ADP2102
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
Parameter
AVIN, EN, MODE, FB/OUT to AGND
LX to PGND
PVIN to PGND
PGND to AGND
AVIN to PVIN
Operating Ambient Temperature Range
Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
?0.3 V to +6 V
?0.3 V to (V IN + 0.3 V)
?0.3 V to +6 V
?0.3 V to +0.3 V
?0.3 V to +0.3 V
?40°C to +85°C 1
?40°C to +125°C
?65°C to +150°C
JEDEC J-STD-020
Junction-to-ambient thermal resistance (θ JA ) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, attention to thermal board
design is required. The value of θ JA may vary, depending on PCB
material, layout, and environmental conditions. Specified value
of θ JA is based on a 4-layer, 4 in × 3 in, 2 1/2 oz copper board,
as per JEDEC standards. For more information, see Application
Note AN-772, A Design and Manufacturing Guide for the Lead
1
The ADP2102 can be damaged when junction temperature limits are exceeded.
Frame Chip Scale Package (LFCSP) .
Monitoring ambient temperature does not guarantee that T J is within the
specified temperature limits. In applications where high power dissipation
and poor thermal resistance are present, the maximum ambient temperature
may have to be derated. In applications with moderate power dissipation
and low PCB thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature is within
Table 3. Thermal Resistance
Package Type
8-Lead LFCSP
Maximum Power Dissipation
θ JA
54
0.74
Unit
°C/W
W
specification limits. The junction temperature (T J ) of the device is dependent
on the ambient temperature (T A ), the power dissipation of the device (PD),
and the junction-to-ambient thermal resistance of the package (θ JA ). Maximum
junction temperature (T J ) is calculated from the ambient temperature (T A )
and power dissipation (PD) using the formula T J = T A + ( θ JA × PD ). Unless
otherwise specified, all other voltages are referenced to AGND.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to PCB.
ESD CAUTION
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. B | Page 4 of 24
相关PDF资料
ECM10DCMD-S288 CONN EDGECARD 20POS .156 EXTEND
ADP2102-1.875EVALZ BOARD EVAL FOR ADP2102-1.875
195D685X0016X2T CAP TANT 6.8UF 16V 20% 2910
A9BAG-1108F FLEX CABLE - AFF11G/AF11/AFE11T
GEM12DSES-S243 CONN EDGECARD 24POS .156 EYELET
EBM08DCCN-S189 CONN EDGECARD 16POS R/A .156 SLD
ADP2102-1.5-EVALZ BOARD EVAL FOR ADP2102-1.5
195D475X9020X2T CAP TANT 4.7UF 20V 10% 2910
相关代理商/技术参数
ADP2102-1-EVALZ 功能描述:BOARD EVAL 0.8V-1.2V ADJ OUTPUT RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC,步升 输出及类型:1,非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969
ADP2102-2-EVALZ 功能描述:BOARD EVAL 1.2V-1.5V ADJ OUTPUT RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC,步升 输出及类型:1,非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969
ADP2102-3-EVALZ 功能描述:BOARD EVAL 1.5V-1.875V ADJ OUTPT RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC,步升 输出及类型:1,非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969
ADP2102-4-EVALZ 功能描述:BOARD EVAL 2.5V-3.3V ADJ OUTPUT RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC,步升 输出及类型:1,非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969
ADP2102A-EVALZ 制造商:Analog Devices 功能描述:ADJ OUTPUT FROM 0.8V-1.2V - Bulk
ADP2102B-EVALZ 制造商:Analog Devices 功能描述:ADJ OUTPUT FROM 1.2V-1.5V - Bulk
ADP2102-BL1-EVZ 功能描述:EVAL BLANK ADISIMPOWER ADP2102 RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:- 标准包装:1 系列:- 主要目的:DC/DC,步降 输出及类型:1,非隔离 功率 - 输出:- 输出电压:3.3V 电流 - 输出:3A 输入电压:4.5 V ~ 28 V 稳压器拓扑结构:降压 频率 - 开关:250kHz 板类型:完全填充 已供物品:板 已用 IC / 零件:L7981 其它名称:497-12113STEVAL-ISA094V1-ND
ADP2102C-EVALZ 制造商:Analog Devices 功能描述:ADJ OUTPUT FROM 1.5V-1.875V - Bulk